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Surface Technology Systems PLC. (STS)

ASPECT - A High Throughput MEMS Production Deep Silicon Etch System

The Advanced Silicon Production Etch Cluster Tool (ASPECT) has been specially designed to solve the unique problems associated with deep silicon etching for MEMS device production. The ASPECT system combines the STS powerful ASE® process technology with a dedicated production proven vacuum cassette loaded cluster platform, engineered for the specific requirements of MEMS devices. Using knowledge gained over a 6 year period from its large installed base of production qualified ASE^® systems, STS is in the powerful position of uniquely being able to guarantee both the process repeatability and equipment reliability essential for production applications.

Equipment and process reliability

Since installing its first cluster system in 1991, our philosophy of continuous development has ensured that our cluster systems are always enabled with the most up to date technology. The ASPECT benefits from many unique design features specially developed for MEMS processing, including substrate thickness independent mechanical clamping or Intelligent Release (IR) electrostatic clamping*, precise wafer alignment and guaranteed handling of thinned or bonded wafers. Electrostatic and mechanical clamping development has ensured that even fragile MEMS wafers can be repeatably clamped and released. In addition, production proven semiconductor industry standard Brooks robotics ensures accurate and reliable handling and industrial PCs with Windows based operating software all contribute to ease of use and high uptime.

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