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Surface Technology Systems PLC. (STS)
  • R&D/Pilot Production Systems - MACS
STS’ latest addition to the Multiplex family of etch and deposition systems, the Multiplex Atmospheric Cassette System or MACS, provides a simple, cost effective cassette to cassette upgrade for load-locked systems

The MACS is a low cost cassette to cassette upgrade to STS' Multiplex range of vacuum load-locked plasma etch and deposition systems. By combining the in-vacuum wafer exchange of the Multiplex Carousel load-lock with an atmospheric robot and cassette, the MACS is able to offer the same throughput as a conventional single chamber vacuum cassette loaded system at a fraction of the cost. In addition the MACS is field-upgradeable, so that a manually loaded system can be initially purchased for R & D or pilot production, and subsequently upgraded to full cassette to cassette operation as product volumes ramp up.

MACS with cleanroom panel removed showing the additional atmospheric robot module required to upgrade existing Multiplex systems to full MACS capability.

MACS Outline

  • Wafer size 3 inch to 200mm
  • Dual cassette Atmospheric robot
  • Optional wafer aligner
  • Wafer mapping at cassette, robot and load-lock
  • Flexible Windows software - multiple recipes for each cassette
  • Small footprint
  • Compliance with CE & SEMI S2 safety specs.
  • Optional clean room interface panel
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