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• R&D/Pilot Production Systems - Multiplex Systems

Multiplex systems are designed with flexibility in mind and allow the simple integration of electrostatic or mechanical wafer clamping, laser or optical end point detection and single or multi-wafer handling capability. The systems are configured with a carousel loadlock as standard allowing 4 x 3", 3 x 100mm, 2 x 150mm and 2 x 200mm wafers, or for substrate carriers up to 240mm in diameter to be used.

Windows based control software completes the package, providing a user friendly process interface, fully automatic operation, password protected operator and engineering levels and full data logging. Remote monitoring from locations outside of the cleanroom is also available as well as a remote recipe editing facility.

As wafer volumes increase and a shift from an R&D to production mode is required, the Multiplex range can be retrofitted with the STS MACS system, a robotic handling system which allows cassette to cassette operation. Alternatively, the process chamber can also be easily removed from the loadlock and used to upgrade to a multi-chamber cluster tool with cassette loading option.

Multiplex Outline

• Wafer size 3 inch to 200mm
  
• Choice of ASE®, ASEHR, ICP, RIE, XeF2 etch, or PECVD deposition sources
  
• Flexible Windows software
  
• Small footprint
  
• Optional clean room interface panel
  
• Simple upgrade path to cassette to cassette operation

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