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7AF-IIThe 7AF-II wafer grinders are the latest release in grinding equipment. The system provides fully automated, cassette-to-cassette wafer handling for 50mm to 200mm wafers, and share the same layout as our 7AF and now offers an all new windows-based operating system and state-of-the-art controls. The 7AF grinders offer exceptional process repeatability, reduced setup times, and improved wafer-to-wafer consistency. They are ideal for Si, GaAs, InP, LiNbO3, quartz and other brittle, soft materials.
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