7AF-HMG

Revasum’s 7AF-HMG (Hard Materials Grinder) provides superior process performance for the most challenging hard materials, such as sapphire and silicon carbide, and . The 7AF-HMG is our latest release in grinding equipment and is an upgraded version of our best-selling 7AF wafer grinder. It is fully automated with wafer handling capability from 50 mm to 200 mm.

Revasum’s 7AF-HMG combines hardware and software improvements with optimized wheels to achieve flatter wafers, with a super fine surface finish and lower sub-surface damage at a lower cost per wafer.

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