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The RVP-300 vertical batch furnace is a flexible platform for diffusion, oxidation and LPCVD processes with leading productivity and low cost of ownership (CoO) on 200 and 300 mm wafers.
Process Flexibility
Run 200 and 300 mm simultaneously with no hardware changes
Compatible with bonded, thin and bowed substrates
Modular hardware enables rapid system conversion for specific applications
Advanced across-flow chamber design for enhanced process control
Low Cost of Ownership
Dual-boat configuration eliminates wafer load/unload time
In-situ clean capability reduces CoO by up to 50%
Fast temperature ramp/cool option enables up to 30% reduction in process time
Factory certified remanufactured systems available
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