XeF2 Release Etch

Xactix^® XeF₂ Release Etch Systems Isotropic etching of silicon using xenon difluoride is an ideal solution for releasing MEMS devices. XeF₂ shows high selectivity to silicon over almost all standard semiconductor materials including photoresist, silicon dioxide, silicon nitride and aluminum. Being a vapor phase etchant, XeF₂ avoids many of the problems typically associated with wet or plasma etch processes.

SPTS offers the following Xactix^® xenon difluoride etching systems:

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XeF2 Release Etch