The Xactix^® X4 Series^TM is the leading XeF₂ etch system for releasing MEMS devices. Its accelerated etch rates and superior components make it ideal for applications from intensive R&D to pilot production.

Key Benefits

• Equipped with our patented dual expansion chamber design for high etch rates
• Allows for high XeF₂ gas flow and pressure without dilution from carrier gases
• Provides both pulsed and continuous flow etch processes
• Unique expansion chamber based design contributes to precise, repeatable pulse pressure and ease of mixing XeF₂ with other gases
• Customizable chamber size can be matched to the wafer size resulting in maximized etch rates, uniformity and efficiency
• Easy to use, reliable and safe