Wafer bonding has found many applications in the field of MST, MEMS, III-Vs & ICs and AML machines can be used in the following applications:
- High accuracy aligned adhesive bonding “best tool”.
- MEMS devices - pressure sensors, accelerometers.
- Vacuum encapsulation – ‘best tool on the market’.
- 1st Level Packaging of devices e.g. silicon microstructures to isolate package induced stresses.
- Wafer Scale Packaging – MEMS & IC.
- III-V bonding e.g. new high performance LEDs.
- 3D Interconnects & TSV.
- Temporary bonds for handle wafers.
- Advanced bonded substrates e.g. silicon-on-glass (SOG).
- Smart cut - Layer transfer.
- Microfluidics.
