Applied Microengineering Ltd (AML)

AML are experienced in designing & making MEMS devices such as Microsensors & Microfluidic devices and Aligned Wafer Bonding has grown out of this. Their unique in-situ aligned bonding machines are our main focus.

The latest AML machine is particularly suited to the bonding requirements of the new high brightness LEDs now being manufactured. It can be used for NIL & other pattern transfer techniques. With an integral aligner it has the fastest throughput on the market.

AML offers the best bonding package, in terms of cost, performance & the flexibility to satisfy most MEMS applications.

AWB series
- No wafer movement between alignment & bonding – guaranteed alignment accuracy
- Simultaneous alignment, heating and vacuum pump-down (fastest cycle time)
- In-bond chamber alignment at bond temperature (reduces expansion misalignment effects you
  would see with competitors jigging)
- No flags touching bond surfaces so no possibility of contamination, damage or flag removal issues
- Best system for vacuum encapsulation (Large gap between wafers during pump-down)
- Independent control of upper & Lower wafer temperatures - (useful for getter activation)
- Best system for reducing / forming gas environment - e.g. for eutectic bonding (reproducible wafer
  surface environment).
- Wide range of processes possible - Including Nano-Imprint

www.aml.co.uk