SiC

Demand for SiC substrates is growing as the demand for SiC-based power and RF devices increases. Yet the adoption of SiC is slowed by cost and by the difficulty of processing the material. 

Revasum has developed a streamlined grind and polish process that eliminates conventional lapping and diamond polishing steps and the associated issues. Revasum’s solution reduces the overall cost to manufacture SiC substrates, in addition to improving quality, productivity and yield -- removing two barriers to more rapid growth in demand for SiC.

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