The AVP/RVP vertical batch furnace delivers superior process results, the lowest cost of ownership (CoO) and leading flexibility for diffusion, oxidation and LPCVD applications.
Superior process results
- Thermal control from 100 to >1200°C
- Advanced injector technology for optimal gas distribution
- Low O2 load lock maintains controlled wafer environment and ensures repeatability
Low cost of ownership
- Single or dual-boat configuration
- Dual-boat configuration eliminates wafer load/unload time
- In-situ clean capability reduces CoO by up to 50%
- Fast temperature ramp/cool option enables up to 30% reduction in processtime
System flexibility
- Run 2 wafer sizes simultaneously with no hardware changes
- Compatible with perforated, bonded and ultra-thin substrates
- Field conversion kits enable fast applications changes
