RVP-300

The RVP-300 vertical batch furnace is a flexible platform for diffusion, oxidation and LPCVD processes with leading productivity and low cost of ownership (CoO) on 200 and 300 mm wafers.

Process Flexibility

• Run 200 and 300 mm simultaneously with no hardware changes
• Compatible with bonded, thin and bowed substrates
• Modular hardware enables rapid system conversion for specific applications
• Advanced across-flow chamber design for enhanced process control

Low Cost of Ownership

• Dual-boat configuration eliminates wafer load/unload time
• In-situ clean capability reduces CoO by up to 50%
• Fast temperature ramp/cool option enables up to 30% reduction in process time
• Factory certified remanufactured systems available

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