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Specializes in the following foreign brands:
Thin Film Deposition:
ALD/ MVD
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PECVD
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PVD
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TEOS/ POCl3/ TMPI/ TMB
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Oxidation
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Diffusion
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LPCVD
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Photolithography:
Coat (spray/ spin) & Developer System
Lift-Off/ Anneal
Cleaner & Others
Wafer Inspection & Sorting Systems
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Maskless Photolithography
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Mask Aligner
Solar Cell Tester
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Etching:
Single Side Wafer Processing
Wafer Thinning
Stress Relief
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Wet Processing Station
IPA dryer
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CMP
Grinding
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Plasma etch
Deep Si etch
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Plasma etch
Dielectric
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Plasma etch
Compound
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Plasma etch
Metal
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Cleaning:
Wet Processing Station
Mega-sonic system
Ultra-sonic system
Ozone Wet Strip
IPA Dryer
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Wafer Bonding:
Wafer Bonder
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Sacrifical Release:
Si Etch Release (XeF2)
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SiO2 Etch Release (VHF)
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Dicing:
Saw Dicing
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Plasma Dicing
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Miscellaneous:
Bonded Wafer Inspection
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Lift-Off/ Anneal
Cleaner & Others
Wafer Inspection & Sorting Systems
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Gas panels
Gas Cabinets
Components
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Wafer Transfer
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RF Generator
Amplifer
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TEOS/ POCl3/ TMPI/ TMB
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Plasma etch system - ICP
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Plasma etch system - ICP
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