About AML 

 

Applied Microengineering Ltd (AML) is an independent private company established in 1992...

We manufacture unique in-situ aligned wafer bonding machines and provides services based around waferbonding in its state-of-the-art multi-million pound BONDCENTRE facility situated on UK’s premiere science park in Harwell, Oxfordshire.

Our unique Aligned Wafer Bonder machines, the only machines capable of in-situ alignment, activation and bonding on the market, are particularly suited to the bonding requirements of MEMS, IC, & III-V industries. The machines have the flexibility for R&D and the throughput and automation for volume production as well as the lowest cost of ownership and first class support.

The machines and services are sold worldwide via agents & distributors: China, Hong Kong, USA, India, Israel, Europe, Canada, Japan, Korea, Taiwan, Singapore and Australia.

We also have a comprehensive BONDCENTRE which provides services from the development of bonding processes to a commercial bonding service – one off to low volume. Associated services include; powder blasting, screen printing & metrology, a ‘One Stop’ wafer bonding service. The BONDCENTRE offers the perfect venue for those involved in bonded substrates, device fabrication, 3D integration and wafer level packaging.

First in Micro-Nano Technology

AML was the first company formed specifically to exploit MEMS technology or Micro-Nano Technology (MNT) as it is now known. After a number of years designing and producing MEMS devices such as Micro sensors and Microfuidic devices, AML changed direction and now focuses solely on wafer bonding equipment & services.